Introduction: The Data Center Life Cycle (and Where We Are Now)
The easiest way to understand the AI data-center boom is to treat it like an industrial supply chain. The “product” isn’t the building—it’s energized megawatts converted into reliable compute. That conversion happens through a sequence of stages, and each stage has its own critical suppliers.
Right now (late 2025), the buildout feels like scale-up meets constraints: AI demand is pressing forward, but timelines are often dictated by power availability, interconnect queues, long-lead electrical gear, and liquid-cooling readiness. That typically shifts near-term outperformance toward the “constraint solvers” (grid + power + thermal + networking) even while GPUs remain the headline.
Stage scoreboard: bottleneck + signals + estimated durations
| Stage | What tends to bottleneck | Typical Duration | Attention (proxy) | Sentiment (proxy) |
|---|---|---|---|---|
| 1) Site & Power Rights | Permits, utility commitments, “deliverable” MW | 6–24 months | 3.0% | +2 |
| 2) Design & Engineering | Standardization, liquid-cooling architecture, speed-to-build | 2–6 months | 2.2% | +3 |
| 3) Grid Interconnect & Long-Lead Gear | Transformers, switchgear, substation capacity, commissioning to energize | 12–36 months | 4.5% | +4 |
| 4) Shell + Fit-Out | UPS/gensets, busway, cooling hardware, integration | 6–18 months | 3.2% | +3 |
| 5) Compute (Servers/Accelerators) | Supply allocation, integration, deployment cadence | 1–4 months | 5.0% | +2 |
| 6) Networking & Optics | Bandwidth scaling, optics availability, power efficiency | 1–4 months | 3.4% | +3 |
| 7) Commissioning & Operations | Reliability at density, liquid-cooling service maturity | 1–3 months (then ongoing) | 2.0% | +2 |
Stage 1 — Site, Land, Permits, and Power Rights
This stage determines whether a project is “real” or just a render. The most valuable asset is secured power— a credible path to large megawatts on a timeline that matches AI demand. In many markets, land is available; power is not.
Major public players (tickers)
EQIX Equinix (colocation, interconnection ecosystems)
DLR Digital Realty (hyperscale campuses, colocation)
IRM Iron Mountain (data centers as a growth business)
TPL Texas Pacific Land (land + infrastructure optionality angle)
What to watch
- Power queue position and interconnect study progress.
- MW pipeline: how many megawatts can actually come online in 12–36 months.
- Regional friction: zoning, water, and community constraints can extend timelines.
Stage 2 — Design & Engineering the “AI-Ready” Facility
AI facilities are increasingly built from repeatable modules: standardized power distribution, cooling loops, and controls that can be cloned site-to-site. The “AI-ready” question comes down to whether the design supports higher density without constant retrofit work—especially as liquid cooling becomes more common at the top end.
Major public players (tickers)
ETN Eaton (power management; expanding thermal footprint)
HON Honeywell (building automation / controls exposure)
EMR Emerson (industrial automation / controls exposure)
SIE.DE Siemens (electrification, automation ecosystem)
SU.PA Schneider Electric (data-center power + cooling ecosystem; France listing)
What to watch
- Reference designs that shorten deployment time and reduce commissioning risk.
- Cooling architecture decisions (air vs liquid vs hybrid) and upgrade paths.
- Controls and monitoring (they matter more as density rises).
Stage 3 — Grid Interconnect & Long-Lead Electrical Equipment (The Bottleneck Stage)
This is the stage that quietly dominates timelines. You can build a shell and even pre-stage equipment, but without energized capacity—transformers, switchgear, and substation work—you don’t have a functioning AI facility. When grid gear is constrained, suppliers often gain pricing power and backlog visibility.
Major public players (tickers)
GEV GE Vernova (grid equipment / electrification exposure)
ETN Eaton (switchgear, power distribution breadth)
HUBB Hubbell (electrical components and grid-related exposure)
ABBN.SW ABB (electrification and grid equipment ecosystem; Switzerland listing)
ENR.DE Siemens Energy (grid equipment exposure; Germany listing)
6501.T Hitachi (grid equipment footprint; Japan listing)
What to watch
- Transformer and switchgear availability (constraints can extend schedules and lift supplier leverage).
- Utility capex and grid upgrade programs (they expand the addressable “buildable MW”).
- Order-to-revenue conversion timing (some suppliers monetize earlier than others).
Stage 4 — Shell + Fit-Out (Where the “AI Factory” Gets Built)
Shell construction is visible, but fit-out is where the economics live: UPS systems, generators, busways, PDUs, cooling distribution, heat exchange, and integration. In an AI build, “fit-out sophistication” increases because density demands tighter control over power stability and thermal behavior.
Major public players (tickers)
VRT Vertiv (critical power + cooling; strong AI data-center exposure)
ETN Eaton (power + thermal adjacency)
SU.PA Schneider Electric (power/cooling ecosystem; France listing)
What to watch
- Liquid cooling hardware pull-through (CDUs, heat exchangers, controls).
- Power-train scaling (how many MW per campus can be supported).
- Service attach (maintenance contracts can stabilize earnings vs project-only revenue).
Stage 5 — Compute & Rack-Scale Systems (GPUs, Servers, Integration)
This is the headline stage: accelerators, servers, and rack-scale systems that can be installed quickly. But “who wins” isn’t only about the best chip—it’s also about who can integrate, deliver, and deploy without power/thermal surprises.
Major public players (tickers)
NVDA NVIDIA (accelerator platform; rack-scale ecosystem)
SMCI Super Micro Computer (AI server integration; liquid-cooled configurations)
HPE Hewlett Packard Enterprise (AI systems offerings / integration)
DELL Dell Technologies (AI server and infrastructure systems)
CSCO Cisco (infrastructure + integration positioning)
What to watch
- Deployment pace vs expectations (timing matters for the market narrative).
- Thermal compatibility (liquid-cooled rack-scale raises execution demands).
- Margin vs volume (integration can be high volume, but execution quality is everything).
Stage 6 — Networking, Optics, and Interconnect (The Cluster Nervous System)
AI clusters don’t scale on GPUs alone. If the network can’t move data fast enough, expensive accelerators sit idle. That keeps spending elevated in switching, interconnect, and optics—often alongside compute, not after it.
Major public players (tickers)
ANET Arista Networks (data-center switching for large AI clusters)
AVGO Broadcom (networking silicon + connectivity exposure)
MRVL Marvell Technology (connectivity silicon exposure)
COHR Coherent (optical components / photonics exposure)
What to watch
- Bandwidth scaling (the “silent limiter” that triggers surprise capex).
- Power efficiency per bit (a constraint that becomes painful at hyperscale).
- Optics tightness (can become the next bottleneck when demand spikes).
Stage 7 — Commissioning, Operations, and Liquid-Cooling Services
Commissioning is where design meets reality. Density reduces tolerance for mistakes: small issues can become expensive reliability events. Once live, the “product” is stable uptime and predictable operations—especially in liquid-cooled environments where operational maturity is a competitive advantage.
Major public players (tickers)
VRT Vertiv (services + thermal management exposure)
ETN Eaton (power and thermal adjacency)
EQIX Equinix (operational execution + monetization)
DLR Digital Realty (scale operations + campus monetization)
What to watch
- Service revenue growth (operations can be stickier than one-time builds).
- Liquid cooling maturity (reduces risk, raises density confidence).
- Energy management (power is a defining cost line in AI compute economics).
Conclusion: The Next Winners Usually Clear the Next Constraint
In a buildout like this, the near-term winners often rotate toward whoever clears the constraint that stands between demand and delivered capacity. Early-cycle returns concentrated in accelerators. In the next leg, outperformance can rotate toward electrification + thermal + networking—the layers that actually turn AI excitement into energized, cooled, connected compute.
Near-future outperformance candidates (by constraint)
-
Power delivery & grid gear (Stage 3):
GEVETNHUBBABBN.SWENR.DE
If grid equipment remains tight, these names often benefit from backlog visibility and mission-critical demand. -
Power + cooling integration (Stages 4 & 7):
VRTETNSU.PA
As liquid cooling becomes a mainstream requirement, the “plumbing” becomes a bigger share of the value chain. -
Networking + optics (Stage 6):
ANETAVGOMRVLCOHR
Bandwidth constraints and optics scaling can drive incremental capex, even when compute remains strong. -
Compute & integration (Stage 5):
NVDASMCIHPEDELL
Still central to the story, but market performance can hinge on deployment pace, execution, and expectations. -
AI-ready capacity owners (Stages 1 & 7):
EQIXDLRIRM
If they control scarce “AI-ready” capacity in constrained markets, monetization can surprise to the upside.